XC6VLX760-L1FFG1760C
vs
XC6VLX760-2FF1760C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
42.50 X 42.50 MM, LEAD FREE, FBGA-1760
42.50 X 42.50 MM, FBGA-1760
Pin Count
1760
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A001.A.7.A
HTS Code
8542.39.00.01
Clock Frequency-Max
1098 MHz
1286 MHz
Combinatorial Delay of a CLB-Max
5.87 ns
0.31 ns
JESD-30 Code
S-PBGA-B1760
S-PBGA-B1760
JESD-609 Code
e1
e0
Length
42.5 mm
42.5 mm
Moisture Sensitivity Level
4
4
Number of Inputs
1200
1200
Number of Logic Cells
758784
758784
Number of Outputs
1200
1200
Number of Terminals
1760
1760
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1760,42X42,40
BGA1760,42X42,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
0.93 V
1.05 V
Supply Voltage-Min
0.87 V
0.95 V
Supply Voltage-Nom
0.9 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
42.5 mm
42.5 mm
Base Number Matches
2
2
Organization
59280 CLBS
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