XC6VLX760-2FFG1760E
vs
XC6VLX760-2FF1760C
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
End Of Life
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| ECCN Code |
3A001.A.7.A
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
1286 MHz
|
1286 MHz
|
| JESD-30 Code |
S-PBGA-B1760
|
S-PBGA-B1760
|
| JESD-609 Code |
e1
|
e0
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
1200
|
1200
|
| Number of Logic Cells |
758784
|
758784
|
| Number of Outputs |
1200
|
1200
|
| Number of Terminals |
1760
|
1760
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1760,42X42,40
|
BGA1760,42X42,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
2
|
2
|
| Package Description |
|
42.50 X 42.50 MM, FBGA-1760
|
| Combinatorial Delay of a CLB-Max |
|
0.31 ns
|
| Length |
|
42.5 mm
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
59280 CLBS
|
| Seated Height-Max |
|
3.5 mm
|
| Supply Voltage-Max |
|
1.05 V
|
| Supply Voltage-Min |
|
0.95 V
|
| Supply Voltage-Nom |
|
1 V
|
| Temperature Grade |
|
OTHER
|
| Width |
|
42.5 mm
|
|
|
|
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