XC6VLX550T-L1FFG1759I vs XC6VLX550T-2FF1759I feature comparison

XC6VLX550T-L1FFG1759I AMD

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XC6VLX550T-2FF1759I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 42.50 X 42.50 MM, FBGA-1759
Reach Compliance Code not_compliant not_compliant
Clock Frequency-Max 1098 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 5.87 ns 4.29 ns
JESD-30 Code S-PBGA-B1759 S-PBGA-B1759
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of Inputs 840 840
Number of Logic Cells 549888 549888
Number of Outputs 840 840
Number of Terminals 1759 1759
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1759,42X42,40 BGA1759,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 0.93 V 1.05 V
Supply Voltage-Min 0.87 V 0.95 V
Supply Voltage-Nom 0.9 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 2
Pbfree Code No
Part Package Code BGA
Pin Count 1759
HTS Code 8542.39.00.01

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