XC6VLX550T-L1FF1759C
vs
XC6VLX550T-L1FFG1759C
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
Package Description |
42.50 X 42.50 MM, FBGA-1759
|
42.50 X 42.50 MM, LEAD FREE, FBGA-1759
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
Clock Frequency-Max |
1098 MHz
|
1098 MHz
|
Combinatorial Delay of a CLB-Max |
5.87 ns
|
5.87 ns
|
JESD-30 Code |
S-PBGA-B1759
|
S-PBGA-B1759
|
JESD-609 Code |
e0
|
e1
|
Length |
42.5 mm
|
42.5 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of Inputs |
840
|
840
|
Number of Logic Cells |
549888
|
549888
|
Number of Outputs |
840
|
840
|
Number of Terminals |
1759
|
1759
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1759,42X42,40
|
BGA1759,42X42,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
0.93 V
|
0.93 V
|
Supply Voltage-Min |
0.87 V
|
0.87 V
|
Supply Voltage-Nom |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
42.5 mm
|
42.5 mm
|
Base Number Matches |
2
|
2
|
|
|
|