XC6VLX550T-2FF1759E
vs
XC6VLX550T-2FFG1759I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ADVANCED MICRO DEVICES INC
|
| Package Description |
FBGA-1759
|
42.50 X 42.50 MM, LEAD FREE, FBGA-1759
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Clock Frequency-Max |
1286 MHz
|
1286 MHz
|
| Combinatorial Delay of a CLB-Max |
0.31 ns
|
0.31 ns
|
| JESD-30 Code |
S-PBGA-B1759
|
S-PBGA-B1759
|
| JESD-609 Code |
e0
|
e1
|
| Length |
42.5 mm
|
42.5 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
840
|
840
|
| Number of Logic Cells |
549888
|
549888
|
| Number of Outputs |
840
|
840
|
| Number of Terminals |
1759
|
1759
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
42960 CLBS
|
42960 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1759,42X42,40
|
BGA1759,42X42,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.5 mm
|
3.5 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
42.5 mm
|
42.5 mm
|
| Base Number Matches |
2
|
2
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|