XC6VLX550T-1FF1759I vs XC6VLX550T-2FF1759C feature comparison

XC6VLX550T-1FF1759I AMD Xilinx

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XC6VLX550T-2FF1759C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 42.50 X 42.50 MM, FBGA-1759 42.50 X 42.50 MM, FBGA-1759
Pin Count 1759 1759
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 5.08 ns 4.29 ns
JESD-30 Code S-PBGA-B1759 S-PBGA-B1759
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of Inputs 840 840
Number of Logic Cells 549888 549888
Number of Outputs 840 840
Number of Terminals 1759 1759
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1759,42X42,40 BGA1759,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 2

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Compare XC6VLX550T-2FF1759C with alternatives