XC6VLX365T-2FFG1759I vs XC6VLX365T-1FFG1759I feature comparison

XC6VLX365T-2FFG1759I AMD

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XC6VLX365T-1FFG1759I AMD

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description 42.50 X 42.50 MM, LEAD FREE, FBGA-1759 42.50 X 42.50 MM, LEAD FREE, FBGA-1759
Reach Compliance Code compliant compliant
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 0.31 ns 0.36 ns
JESD-30 Code S-PBGA-B1759 S-PBGA-B1759
JESD-609 Code e1 e1
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of Inputs 720 720
Number of Logic Cells 364032 364032
Number of Outputs 720 720
Number of Terminals 1759 1759
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 28440 CLBS 28440 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1759,42X42,40 BGA1759,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 2