XC6VLX130T-3FF1156C
vs
XC6VLX130T-1FFG1156C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Package Description
FBGA-1156
35 X 35 MM, LEAD FREE, FBGA-1156
Reach Compliance Code
not_compliant
compliant
Samacsys Manufacturer
AMD
AMD
Clock Frequency-Max
1412 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
0.28 ns
0.36 ns
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1156
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of Inputs
600
600
Number of Logic Cells
128000
128000
Number of Outputs
600
600
Number of Terminals
1156
1156
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
10000 CLBS
10000 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1156,34X34,40
BGA1156,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
2
2
Factory Lead Time
12 Weeks