XC6VLX130T-3FF1156C
vs
XC6VLX130T-2FF1156I
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-1156
FBGA-1156
Pin Count
1156
1156
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1412 MHz
1286 MHz
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1156
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of Inputs
600
600
Number of Logic Cells
128000
128000
Number of Outputs
600
600
Number of Terminals
1156
1156
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1156,34X34,40
BGA1156,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
1
Pbfree Code
No
Factory Lead Time
52 Weeks
Combinatorial Delay of a CLB-Max
4.29 ns
Compare XC6VLX130T-3FF1156C with alternatives
Compare XC6VLX130T-2FF1156I with alternatives