XC6VLX130T-3FF1156C vs XC6VLX130T-2FF1156I feature comparison

XC6VLX130T-3FF1156C AMD Xilinx

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XC6VLX130T-2FF1156I AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-1156 FBGA-1156
Pin Count 1156 1156
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1412 MHz 1286 MHz
JESD-30 Code S-PBGA-B1156 S-PBGA-B1156
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of Inputs 600 600
Number of Logic Cells 128000 128000
Number of Outputs 600 600
Number of Terminals 1156 1156
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA1156,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1
Pbfree Code No
Factory Lead Time 52 Weeks
Combinatorial Delay of a CLB-Max 4.29 ns

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Compare XC6VLX130T-2FF1156I with alternatives