XC6VLX130T-2FFG484I vs XC6VLX130T-L1FFG484I feature comparison

XC6VLX130T-2FFG484I AMD Xilinx

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XC6VLX130T-L1FFG484I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 23 X 23 MM, LEAD FREE, FBGA-484 23 X 23 MM, LEAD FREE, FBGA-484
Pin Count 484 484
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 4.29 ns 5.87 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 4 4
Number of Inputs 240 240
Number of Logic Cells 128000 128000
Number of Outputs 240 240
Number of Terminals 484 484
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3 mm
Supply Voltage-Max 1.05 V 0.93 V
Supply Voltage-Min 0.95 V 0.87 V
Supply Voltage-Nom 1 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 2

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Compare XC6VLX130T-L1FFG484I with alternatives