XC6VLX130T-2FFG1156C
vs
XC6VLX130T-L1FFG1156I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
35 X 35 MM, LEAD FREE, FBGA-1156
35 X 35 MM, LEAD FREE, FBGA-1156
Pin Count
1156
1156
Reach Compliance Code
compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1286 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
4.29 ns
5.87 ns
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1156
JESD-609 Code
e1
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of Inputs
600
600
Number of Logic Cells
128000
128000
Number of Outputs
600
600
Number of Terminals
1156
1156
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1156,34X34,40
BGA1156,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
245
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.05 V
0.93 V
Supply Voltage-Min
0.95 V
0.87 V
Supply Voltage-Nom
1 V
0.9 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
2
2
Compare XC6VLX130T-2FFG1156C with alternatives
Compare XC6VLX130T-L1FFG1156I with alternatives