XC6VLX130T-2FF484C vs XC6VLX130T-L1FFG484C feature comparison

XC6VLX130T-2FF484C AMD

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XC6VLX130T-L1FFG484C AMD

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description FBGA-484 23 X 23 MM, LEAD FREE, FBGA-484
Reach Compliance Code not_compliant not_compliant
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 4.29 ns 5.87 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 23 mm 23 mm
Moisture Sensitivity Level 4 4
Number of Inputs 240 240
Number of Logic Cells 128000 128000
Number of Outputs 240 240
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm 3 mm
Supply Voltage-Max 1.05 V 0.93 V
Supply Voltage-Min 0.95 V 0.87 V
Supply Voltage-Nom 1 V 0.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 2 2
Factory Lead Time 12 Weeks
Samacsys Manufacturer AMD