XC6VHX380T-2FF1154I
vs
XC6VHX380T-1FFG1154C
feature comparison
All Stats
Differences Only
Pbfree Code
No
Yes
Rohs Code
No
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
FBGA-1156
35 X 35 MM, LEAD FREE, FBGA-1154
Pin Count
1156
1154
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
1286 MHz
1098 MHz
Combinatorial Delay of a CLB-Max
4.29 ns
5.08 ns
JESD-30 Code
S-PBGA-B1156
S-PBGA-B1154
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Number of Inputs
320
320
Number of Logic Cells
382464
382464
Number of Outputs
320
320
Number of Terminals
1156
1154
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1154,34X34,40
BGA1154,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.5 mm
3.5 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
35 mm
Base Number Matches
1
1
Moisture Sensitivity Level
4
Peak Reflow Temperature (Cel)
245
Time@Peak Reflow Temperature-Max (s)
30
Compare XC6VHX380T-2FF1154I with alternatives
Compare XC6VHX380T-1FFG1154C with alternatives