XC6VHX380T-2FF1154I vs XC6VHX380T-1FFG1154C feature comparison

XC6VHX380T-2FF1154I AMD Xilinx

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XC6VHX380T-1FFG1154C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-1156 35 X 35 MM, LEAD FREE, FBGA-1154
Pin Count 1156 1154
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1286 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 4.29 ns 5.08 ns
JESD-30 Code S-PBGA-B1156 S-PBGA-B1154
JESD-609 Code e0 e1
Length 35 mm 35 mm
Number of Inputs 320 320
Number of Logic Cells 382464 382464
Number of Outputs 320 320
Number of Terminals 1156 1154
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1154,34X34,40 BGA1154,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 35 mm
Base Number Matches 1 1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30

Compare XC6VHX380T-2FF1154I with alternatives

Compare XC6VHX380T-1FFG1154C with alternatives