XC6VHX380T-1FF1154I
vs
XC6VHX380T-2FFG1154C
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
End Of Life
|
Transferred
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
Package Description |
FBGA-1156
|
35 X 35 MM, LEAD FREE, FBGA-1154
|
Reach Compliance Code |
compliant
|
not_compliant
|
Clock Frequency-Max |
1098 MHz
|
1286 MHz
|
Combinatorial Delay of a CLB-Max |
0.36 ns
|
4.29 ns
|
JESD-30 Code |
S-PBGA-B1156
|
S-PBGA-B1154
|
JESD-609 Code |
e0
|
e1
|
Length |
35 mm
|
35 mm
|
Number of Inputs |
320
|
320
|
Number of Logic Cells |
382464
|
382464
|
Number of Outputs |
320
|
320
|
Number of Terminals |
1156
|
1154
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
29880 CLBS
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1154,34X34,40
|
BGA1154,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.5 mm
|
3.5 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
BGA
|
Pin Count |
|
1154
|
ECCN Code |
|
3A991.D
|
HTS Code |
|
8542.39.00.01
|
Moisture Sensitivity Level |
|
4
|
Peak Reflow Temperature (Cel) |
|
245
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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