XC6SLX9-3CPG196C
vs
XA6SLX9-3CPG196I
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
|
|
| Pin Count |
196
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
862 MHz
|
862 MHz
|
| Combinatorial Delay of a CLB-Max |
0.21 ns
|
0.21 ns
|
| JESD-30 Code |
S-PBGA-B196
|
S-PBGA-B196
|
| JESD-609 Code |
e8
|
e1
|
| Length |
8 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
715
|
|
| Number of Inputs |
100
|
106
|
| Number of Logic Cells |
9152
|
9152
|
| Number of Outputs |
100
|
106
|
| Number of Terminals |
196
|
196
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
715 CLBS
|
715 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
FBGA
|
| Package Equivalence Code |
BGA196,14X14,20
|
BGA196,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
8 mm
|
|
| Base Number Matches |
2
|
2
|
| Screening Level |
|
AEC-Q100; TS 16949
|
|
|
|
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