XC6SLX75T-3FGG676Q
vs
XC6SLX75T-3FG676C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Reach Compliance Code |
compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-609 Code |
e1
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
250
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Package Description |
|
27 X 27 MM, 1 MM PITCH, FBGA-676
|
Pin Count |
|
676
|
ECCN Code |
|
3A991.D
|
Clock Frequency-Max |
|
862 MHz
|
Combinatorial Delay of a CLB-Max |
|
0.21 ns
|
JESD-30 Code |
|
S-PBGA-B676
|
Length |
|
27 mm
|
Number of CLBs |
|
5831
|
Number of Inputs |
|
320
|
Number of Logic Cells |
|
74637
|
Number of Outputs |
|
320
|
Number of Terminals |
|
676
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
5831 CLBS
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
BGA
|
Package Equivalence Code |
|
BGA676,26X26,40
|
Package Shape |
|
SQUARE
|
Package Style |
|
GRID ARRAY
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
2.44 mm
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
OTHER
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
BOTTOM
|
Width |
|
27 mm
|
|
|
|
Compare XC6SLX75T-3FGG676Q with alternatives
Compare XC6SLX75T-3FG676C with alternatives