XC6SLX75-2CSG484I
vs
XC6SLX75-3CS484C
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
|
| Package Description |
19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
|
|
| Pin Count |
484
|
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
667 MHz
|
862 MHz
|
| Combinatorial Delay of a CLB-Max |
0.26 ns
|
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
| JESD-609 Code |
e1
|
e0
|
| Length |
19 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
5831
|
|
| Number of Inputs |
310
|
328
|
| Number of Logic Cells |
74637
|
74637
|
| Number of Outputs |
310
|
328
|
| Number of Terminals |
484
|
484
|
| Operating Temperature-Max |
100 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
5831 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA484,22X22,32
|
BGA484,22X22,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.8 mm
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
19 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC6SLX75-2CSG484I with alternatives
Compare XC6SLX75-3CS484C with alternatives