XC6SLX75-2CSG484I vs XA6SLX75-2CS484I feature comparison

XC6SLX75-2CSG484I AMD Xilinx

Buy Now Datasheet

XA6SLX75-2CS484I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, BGA-484
Pin Count 484
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5831
Number of Inputs 310 328
Number of Logic Cells 74637 74637
Number of Outputs 310 328
Number of Terminals 484 484
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 5831 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm
Base Number Matches 1 1
Screening Level AEC-Q100

Compare XC6SLX75-2CSG484I with alternatives

Compare XA6SLX75-2CS484I with alternatives