XC6SLX45-N3CS484I
vs
XC6SLX45-3NCS484I
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Clock Frequency-Max |
806 MHz
|
806 MHz
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e0
|
e0
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
320
|
320
|
Number of Logic Cells |
43661
|
43661
|
Number of Outputs |
320
|
320
|
Number of Terminals |
484
|
484
|
Package Body Material |
PLASTIC
|
PLASTIC/EPOXY
|
Package Code |
FBGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,32
|
BGA484,22X22,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Base Number Matches |
2
|
2
|
Package Description |
|
FBGA-484
|
Combinatorial Delay of a CLB-Max |
|
0.26 ns
|
Length |
|
19 mm
|
Number of CLBs |
|
3411
|
Operating Temperature-Max |
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
|
3411 CLBS
|
Seated Height-Max |
|
1.8 mm
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
Temperature Grade |
|
INDUSTRIAL
|
Width |
|
19 mm
|
|
|
|
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