XC6SLX45-3NFGG484C vs XC6SLX45-3NFG484I feature comparison

XC6SLX45-3NFGG484C AMD

Buy Now Datasheet

XC6SLX45-3NFG484I AMD Xilinx

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description 23 X 23 MM, 1 MM PITCH, LEAD FREE, MS-034, FBGA-484 23 X 23 MM, 1 MM PITCH, MS-034, FBGA-484
Reach Compliance Code compliant compliant
Clock Frequency-Max 806 MHz 806 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3411
Number of Inputs 316
Number of Outputs 316
Number of Terminals 484 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3411 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 23 mm 23 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 484
HTS Code 8542.39.00.01

Compare XC6SLX45-3NFG484I with alternatives