XC6SLX45-3NCSG324I vs XC6SLX45-N3CSG324C feature comparison

XC6SLX45-3NCSG324I AMD Xilinx

Buy Now Datasheet

XC6SLX45-N3CSG324C AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, MO-275, CSBGA-324 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Pin Count 324
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 806 MHz 806 MHz
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 15 mm 15 mm
Moisture Sensitivity Level 3 3
Number of Terminals 324 324
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 15 mm 15 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Combinatorial Delay of a CLB-Max 0.26 ns
Number of CLBs 3411
Number of Inputs 218
Number of Logic Cells 43661
Number of Outputs 218
Organization 3411 CLBS
Peak Reflow Temperature (Cel) 260
Technology CMOS
Time@Peak Reflow Temperature-Max (s) 30

Compare XC6SLX45-3NCSG324I with alternatives

Compare XC6SLX45-N3CSG324C with alternatives