XC6SLX45-3NCS484I vs XC6SLX45-3NCSG484I feature comparison

XC6SLX45-3NCS484I AMD

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XC6SLX45-3NCSG484I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description FBGA-484 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, CSBGA-484
Reach Compliance Code compliant compliant
Clock Frequency-Max 806 MHz 806 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3411
Number of Inputs 320
Number of Logic Cells 43661
Number of Outputs 320
Number of Terminals 484 484
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 3411 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Part Package Code BGA
Pin Count 484
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

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