XC6SLX45-3NCS484C vs XC6SLX45-3NCSG484C feature comparison

XC6SLX45-3NCS484C AMD Xilinx

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XC6SLX45-3NCSG484C AMD

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Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.26 ns 0.26 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0 e1
Length 19 mm 19 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3411 3411
Number of Inputs 320 320
Number of Logic Cells 43661
Number of Outputs 320 320
Number of Terminals 484 484
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min
Organization 3411 CLBS 3411 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA484,22X22,32 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Temperature Grade COMMERCIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 19 mm 19 mm
Base Number Matches 2 2
Package Description 19 X 19 MM, 0.80 MM PITCH, LEAD FREE, CSBGA-484
Clock Frequency-Max 806 MHz
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

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