XC6SLX45-3CSG324C vs XC6SLX45-2CSG324I feature comparison

XC6SLX45-3CSG324C AMD Xilinx

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XC6SLX45-2CSG324I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Pin Count 324 324
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.26 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 15 mm 15 mm
Moisture Sensitivity Level 3 3
Number of CLBs 3411 3411
Number of Inputs 218 218
Number of Logic Cells 43661 43661
Number of Outputs 218 218
Number of Terminals 324 324
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3411 CLBS 3411 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm 15 mm
Base Number Matches 1 1

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