Findchips: Compare XC6SLX4-L1CSG225I vs XC6SLX4-L1CSG225C

XC6SLX4-L1CSG225I vs XC6SLX4-L1CSG225C feature comparison

XC6SLX4-L1CSG225I AMD Xilinx

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XC6SLX4-L1CSG225C AMD Xilinx

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Pbfree Code	Yes	Yes
Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225	13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count	225	225
Reach Compliance Code	compliant	compliant
ECCN Code	EAR99	EAR99
HTS Code	8542.39.00.01	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.46 ns	0.46 ns
JESD-30 Code	S-PBGA-B225	S-PBGA-B225
JESD-609 Code	e1	e1
Length	13 mm	13 mm
Moisture Sensitivity Level	3	3
Number of CLBs	300	300
Number of Inputs	120	132
Number of Logic Cells	3840	3840
Number of Outputs	120	132
Number of Terminals	225	225
Operating Temperature-Max	100 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	300 CLBS	300 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Equivalence Code	BGA225,15X15,32	BGA225,15X15,32
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)	260	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.4 mm	1.4 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	OTHER
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	13 mm	13 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays