XC6SLX25T-4CSG324C
vs
XA6SLX25T-3CSG324I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
Package Description
15 X 15 MM, 0.80 MM PITCH, LEAD FREE, CSBGA-324
Pin Count
324
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B324
S-PBGA-B324
JESD-609 Code
e1
e1
Length
15 mm
Moisture Sensitivity Level
3
3
Number of Inputs
190
190
Number of Logic Cells
24051
24051
Number of Outputs
190
190
Number of Terminals
324
324
Operating Temperature-Max
85 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
FBGA
Package Equivalence Code
BGA324,18X18,32
BGA324,18X18,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
15 mm
Base Number Matches
1
1
ECCN Code
EAR99
Clock Frequency-Max
62.5 MHz
Screening Level
AEC-Q100
Compare XC6SLX25T-4CSG324C with alternatives
Compare XA6SLX25T-3CSG324I with alternatives