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XC6SLX16-3FTG256C vs XC6SLX16-3FT256I feature comparison

XC6SLX16-3FTG256C AMD Xilinx

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XC6SLX16-3FT256I AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 17 X 17 MM, 1 MM PITCH, FBGA-256
Pin Count 256 256
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.21 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1139 1139
Number of Inputs 186 186
Number of Logic Cells 14579 14579
Number of Outputs 186 186
Number of Terminals 256 256
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1139 CLBS 1139 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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