XC6SLX16-3CPG196I
vs
XC6SLX16-3CPG196C
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
Pin Count
196
196
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
862 MHz
862 MHz
Combinatorial Delay of a CLB-Max
0.21 ns
0.21 ns
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
JESD-609 Code
e8
e8
Length
8 mm
8 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1139
1139
Number of Inputs
106
100
Number of Logic Cells
14579
14579
Number of Outputs
106
100
Number of Terminals
196
196
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1139 CLBS
1139 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA196,14X14,20
BGA196,14X14,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.1 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
8 mm
8 mm
Base Number Matches
1
1