XC6SLX16-3CPG196I vs XC6SLX16-3CPG196C feature comparison

XC6SLX16-3CPG196I AMD Xilinx

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XC6SLX16-3CPG196C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196
Pin Count 196 196
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.21 ns
JESD-30 Code S-PBGA-B196 S-PBGA-B196
JESD-609 Code e8 e8
Length 8 mm 8 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1139 1139
Number of Inputs 106 100
Number of Logic Cells 14579 14579
Number of Outputs 106 100
Number of Terminals 196 196
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1139 CLBS 1139 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA196,14X14,20 BGA196,14X14,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 8 mm
Base Number Matches 1 1