XC6SLX16-2CPG196C vs XC6SLX16-2CSG324C feature comparison

XC6SLX16-2CPG196C AMD Xilinx

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XC6SLX16-2CSG324C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 8 X 8 MM, 0.50 MM PITCH, LEAD FREE, BGA-196 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Pin Count 196 324
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.26 ns
JESD-30 Code S-PBGA-B196 S-PBGA-B324
JESD-609 Code e8 e1
Length 8 mm 15 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1139 1139
Number of Inputs 100 232
Number of Logic Cells 14579 14579
Number of Outputs 100 232
Number of Terminals 196 324
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 1139 CLBS 1139 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA196,14X14,20 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.5 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 8 mm 15 mm
Base Number Matches 1 1

Compare XC6SLX16-2CPG196C with alternatives

Compare XC6SLX16-2CSG324C with alternatives