XC6SLX150-2FG676I
vs
XC6SLX150-3FG676I
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, 1 MM PITCH, FBGA-676
27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count
676
676
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
667 MHz
862 MHz
Combinatorial Delay of a CLB-Max
0.26 ns
0.21 ns
JESD-30 Code
S-PBGA-B676
S-PBGA-B676
JESD-609 Code
e0
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
11519
11519
Number of Inputs
498
498
Number of Logic Cells
147443
147443
Number of Outputs
498
498
Number of Terminals
676
676
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
11519 CLBS
11519 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA676,26X26,40
BGA676,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
27 mm
27 mm
Base Number Matches
2
2
Compare XC6SLX150-2FG676I with alternatives
Compare XC6SLX150-3FG676I with alternatives