XC6SLX100T-4FG676I vs XC6SLX100T-2FGG676I feature comparison

XC6SLX100T-4FG676I AMD Xilinx

Buy Now Datasheet

XC6SLX100T-2FGG676I AMD Xilinx

Buy Now Datasheet
Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
Pin Count 676 676
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Inputs 376 376
Number of Logic Cells 101261 101261
Number of Outputs 376 376
Number of Terminals 676 676
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.6 mm 2.44 mm
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
Number of CLBs 7911
Organization 7911 CLBS
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V

Compare XC6SLX100T-4FG676I with alternatives

Compare XC6SLX100T-2FGG676I with alternatives