XC6SLX100T-4FG676I
vs
XC6SLX100T-2FGG676I
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
27 X 27 MM, 1 MM PITCH, FBGA-676
|
27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
|
Pin Count |
676
|
676
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
JESD-609 Code |
e0
|
e1
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
376
|
376
|
Number of Logic Cells |
101261
|
101261
|
Number of Outputs |
376
|
376
|
Number of Terminals |
676
|
676
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.6 mm
|
2.44 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
3A991.D
|
Clock Frequency-Max |
|
667 MHz
|
Combinatorial Delay of a CLB-Max |
|
0.26 ns
|
Number of CLBs |
|
7911
|
Organization |
|
7911 CLBS
|
Supply Voltage-Max |
|
1.26 V
|
Supply Voltage-Min |
|
1.14 V
|
Supply Voltage-Nom |
|
1.2 V
|
|
|
|
Compare XC6SLX100T-4FG676I with alternatives
Compare XC6SLX100T-2FGG676I with alternatives