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XC6SLX100T-2FGG676C vs XC6SLX100T-4FGG676I feature comparison

XC6SLX100T-2FGG676C AMD Xilinx

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XC6SLX100T-4FGG676I AMD

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Part Package Code BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676
Pin Count 676
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.31 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 7911 7911
Number of Inputs 376 376
Number of Logic Cells 101261 101261
Number of Outputs 376 376
Number of Terminals 676 676
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 7911 CLBS 7911 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.6 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 2 2
Programmable Logic » Field Programmable Gate Arrays
Programmable Logic » Field Programmable Gate Arrays

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