XC6501A3517R-G
vs
XC6501B34B0R-G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOREX SEMICONDUCTOR LTD
|
TOREX SEMICONDUCTOR LTD
|
| Package Description |
USPN-4
|
WLP-4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
12 Weeks
|
| Dropout Voltage1-Max |
0.35 V
|
0.35 V
|
| Dropout Voltage1-Nom |
0.14 V
|
0.14 V
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
4 V
|
3.95 V
|
| JESD-30 Code |
R-XBCC-B4
|
S-PBGA-B4
|
| JESD-609 Code |
e4
|
|
| Length |
1.2 mm
|
0.7 mm
|
| Load Regulation-Max |
0.045%
|
0.045%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Output Current1-Max |
0.2 A
|
0.2 A
|
| Output Voltage1-Max |
3.535 V
|
3.519 V
|
| Output Voltage1-Min |
3.465 V
|
3.381 V
|
| Output Voltage1-Nom |
3.5 V
|
3.45 V
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
BCC
|
VFBGA
|
| Package Equivalence Code |
SOLCC4,.05,22
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.4 mm
|
0.2 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
NICKEL GOLD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.55 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
10
|
| Voltage Tolerance-Max |
1%
|
2%
|
| Width |
0.9 mm
|
0.7 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC6501A3517R-G with alternatives
Compare XC6501B34B0R-G with alternatives