XC6233H321GR-G
vs
BU29TD3WG-GTR
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOREX SEMICONDUCTOR LTD
|
ROHM CO LTD
|
| Package Description |
ANTIMONY AND HALOGEN FREE, ROHS COMPLIANT, USP-4
|
LSSOP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
|
| Samacsys Manufacturer |
Torex
|
|
| Dropout Voltage1-Max |
0.38 V
|
0.46 V
|
| Dropout Voltage1-Nom |
0.24 V
|
0.24 V
|
| Input Voltage-Max |
5.5 V
|
6 V
|
| Input Voltage-Min |
1.7 V
|
3.9 V
|
| JESD-30 Code |
R-PDSO-N4
|
R-PDSO-G5
|
| Length |
1.6 mm
|
2.9 mm
|
| Load Regulation-Max |
0.045%
|
0.08%
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
5
|
| Output Current1-Max |
0.2 A
|
0.2 A
|
| Output Voltage1-Max |
3.232 V
|
2.929 V
|
| Output Voltage1-Min |
3.168 V
|
2.871 V
|
| Output Voltage1-Nom |
3.2 V
|
2.9 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSSOP
|
| Package Equivalence Code |
SOLCC4,.04,24
|
TSOP5/6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.6 mm
|
1.45 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
NICKEL SILVER GOLD
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.6 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
|
| Voltage Tolerance-Max |
1%
|
1%
|
| Width |
1.2 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| Adjustability |
|
FIXED
|
| Input Voltage Absolute-Max |
|
6.5 V
|
| Line Regulation-Max |
|
0.02%
|
| Number of Outputs |
|
1
|
| Operating Temperature TJ-Max |
|
125 °C
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Packing Method |
|
TR, EMBOSSED
|
| Technology |
|
CMOS
|
|
|
|
Compare XC6233H321GR-G with alternatives
Compare BU29TD3WG-GTR with alternatives