XC6229H34B1R-G
vs
NCP114ASN300T1G
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOREX SEMICONDUCTOR LTD
|
ONSEMI
|
| Package Description |
LGA-4
|
TSOP-5
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
4 Weeks
|
| Dropout Voltage1-Max |
0.26 V
|
0.245 V
|
| Dropout Voltage1-Nom |
0.16 V
|
0.16 V
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
3.95 V
|
3.5 V
|
| JESD-30 Code |
S-XBGA-B4
|
R-PDSO-G5
|
| Length |
0.75 mm
|
3 mm
|
| Load Regulation-Max |
0.045%
|
0.045%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
5
|
| Operating Temperature TJ-Max |
125 °C
|
85 °C
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
3.4845 V
|
3.06 V
|
| Output Voltage1-Min |
3.4155 V
|
2.94 V
|
| Output Voltage1-Nom |
3.45 V
|
3 V
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VFLGA
|
TSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.3 mm
|
1.1 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Nickel/Silver/Gold (Ni/Ag/Au)
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.4 mm
|
0.95 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
30
|
| Voltage Tolerance-Max |
1%
|
2%
|
| Width |
0.75 mm
|
1.5 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
483
|
| Samacsys Manufacturer |
|
onsemi
|
| Adjustability |
|
FIXED
|
| Input Voltage Absolute-Max |
|
6 V
|
| JESD-609 Code |
|
e3
|
| Line Regulation-Max |
|
0.006%
|
| Number of Outputs |
|
1
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Package Equivalence Code |
|
TSOP5/6,.11,37
|
| Packing Method |
|
TR
|
| Technology |
|
CMOS
|
|
|
|
Compare XC6229H34B1R-G with alternatives
Compare NCP114ASN300T1G with alternatives