XC6209F32ADR-G
vs
XC6209F32AMR-G
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
TOREX SEMICONDUCTOR LTD
|
TOREX SEMICONDUCTOR LTD
|
| Part Package Code |
SOIC
|
SOT
|
| Package Description |
HVSON,
|
LSSOP,
|
| Pin Count |
6
|
5
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
12 Weeks
|
8 Weeks
|
| Dropout Voltage1-Max |
0.25 V
|
0.25 V
|
| Dropout Voltage1-Nom |
0.2 V
|
0.2 V
|
| Input Voltage-Max |
10 V
|
10 V
|
| Input Voltage-Min |
2 V
|
2 V
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-G5
|
| Length |
2 mm
|
2.9 mm
|
| Load Regulation-Max |
0.1%
|
0.1%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
5
|
| Output Current1-Max |
0.3 A
|
0.3 A
|
| Output Voltage1-Max |
3.315 V
|
3.315 V
|
| Output Voltage1-Min |
3.185 V
|
3.185 V
|
| Output Voltage1-Nom |
3.25 V
|
3.25 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSSOP
|
| Package Equivalence Code |
SOLCC6,.07,20
|
SOP5,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
0.7 mm
|
1.3 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Finish |
NICKEL SILVER GOLD
|
TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
10
|
| Voltage Tolerance-Max |
2%
|
2%
|
| Width |
1.8 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e3
|
|
|
|
Compare XC6209F32ADR-G with alternatives
Compare XC6209F32AMR-G with alternatives