XC5VSX95T-3FF1136C
vs
XQ5VSX95T-2EF1136I
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
35 X 35 MM, FLIP CHIP-1136
|
FCBGA-1136
|
| Pin Count |
1136
|
1136
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Clock Frequency-Max |
550 MHz
|
1265 MHz
|
| JESD-30 Code |
S-PBGA-B1136
|
S-PBGA-B1136
|
| JESD-609 Code |
e0
|
e0
|
| Length |
35 mm
|
35 mm
|
| Moisture Sensitivity Level |
4
|
|
| Number of CLBs |
7360
|
7360
|
| Number of Inputs |
640
|
640
|
| Number of Logic Cells |
94208
|
94208
|
| Number of Outputs |
640
|
640
|
| Number of Terminals |
1136
|
1136
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
7360 CLBS
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA1136,34X34,40
|
BGA1136,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.4 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
35 mm
|
35 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
3A991.D
|
| Combinatorial Delay of a CLB-Max |
|
0.77 ns
|
|
|
|
Compare XC5VSX95T-3FF1136C with alternatives
Compare XQ5VSX95T-2EF1136I with alternatives