XC5VSX50T-2FFV1136C
vs
XC5VSX50T-2FF1136I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Package Description |
BGA-1136
|
BGA-1136
|
Reach Compliance Code |
unknown
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Combinatorial Delay of a CLB-Max |
0.77 ns
|
0.77 ns
|
JESD-30 Code |
S-PBGA-B1136
|
S-PBGA-B1136
|
JESD-609 Code |
e1
|
e0
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
4080
|
4080
|
Number of Inputs |
480
|
480
|
Number of Logic Cells |
52224
|
52224
|
Number of Outputs |
480
|
480
|
Number of Terminals |
1136
|
1136
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
4080 CLBS
|
4080 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1136,34X34,40
|
BGA1136,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
3.25 mm
|
3.25 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
1136
|
Factory Lead Time |
|
72 Weeks
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare XC5VSX50T-2FFV1136C with alternatives
Compare XC5VSX50T-2FF1136I with alternatives