XC5VSX240T-2FFG1738C vs XQ5VSX240T-1FF1738I feature comparison

XC5VSX240T-2FFG1738C AMD Xilinx

Buy Now Datasheet

XQ5VSX240T-1FF1738I AMD Xilinx

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1738 FCBGA-1738
Pin Count 1738 1738
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.77 ns 0.9 ns
JESD-30 Code S-PBGA-B1738 S-PBGA-B1738
JESD-609 Code e1 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 18720 18720
Number of Inputs 960 960
Number of Logic Cells 239616 239616
Number of Outputs 960 960
Number of Terminals 1738 1738
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 18720 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1738,42X42,40 BGA1738,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 42.5 mm 42.5 mm
Base Number Matches 1 1
Clock Frequency-Max 1098 MHz

Compare XC5VSX240T-2FFG1738C with alternatives

Compare XQ5VSX240T-1FF1738I with alternatives