XC5VLX85-3FF1153C
vs
XC5VLX85-3FF1153I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
XILINX INC
XILINX INC
Part Package Code
BGA
Package Description
BGA-1153
Pin Count
1153
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.67 ns
JESD-30 Code
S-PBGA-B1153
S-PBGA-B1153
JESD-609 Code
e0
e0
Length
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
6480
Number of Inputs
560
560
Number of Logic Cells
82944
6480
Number of Outputs
560
560
Number of Terminals
1153
1153
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
6480 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1153,34X34,40
BGA1153,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.4 mm
Supply Voltage-Max
1.05 V
Supply Voltage-Min
0.95 V
Supply Voltage-Nom
1 V
Surface Mount
YES
YES
Temperature Grade
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
Base Number Matches
2
2
Clock Frequency-Max
710 MHz
Technology
CMOS
Compare XC5VLX85-3FF1153C with alternatives
Compare XC5VLX85-3FF1153I with alternatives