XC5VLX50T-1FF665I
vs
XC5VLX50T-1FFV665I
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
|
Package Description |
BGA-665
|
BGA, BGA665,26X26,40
|
Pin Count |
665
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
72 Weeks
|
|
Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
JESD-30 Code |
S-PBGA-B665
|
S-PBGA-B665
|
JESD-609 Code |
e0
|
|
Length |
27 mm
|
27 mm
|
Moisture Sensitivity Level |
4
|
|
Number of CLBs |
3600
|
3600
|
Number of Inputs |
360
|
360
|
Number of Logic Cells |
46080
|
46080
|
Number of Outputs |
360
|
360
|
Number of Terminals |
665
|
665
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
3600 CLBS
|
3600 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA665,26X26,40
|
BGA665,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
2.9 mm
|
2.9 mm
|
Supply Voltage-Max |
10.5 V
|
10.5 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
27 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC5VLX50T-1FF665I with alternatives
Compare XC5VLX50T-1FFV665I with alternatives