XC5VLX50T-1FF665I vs XC5VLX50T-1FFV665I feature comparison

XC5VLX50T-1FF665I AMD Xilinx

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XC5VLX50T-1FFV665I AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description BGA-665 BGA, BGA665,26X26,40
Pin Count 665
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 72 Weeks
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B665 S-PBGA-B665
JESD-609 Code e0
Length 27 mm 27 mm
Moisture Sensitivity Level 4
Number of CLBs 3600 3600
Number of Inputs 360 360
Number of Logic Cells 46080 46080
Number of Outputs 360 360
Number of Terminals 665 665
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 3600 CLBS 3600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA665,26X26,40 BGA665,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.9 mm 2.9 mm
Supply Voltage-Max 10.5 V 10.5 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm 27 mm
Base Number Matches 1 1

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Compare XC5VLX50T-1FFV665I with alternatives