XC5VLX50T-1FF1136C
vs
XC5VLX50T-1FFG1136C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
BGA-1136
BGA-1136
Pin Count
1136
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Factory Lead Time
72 Weeks
12 Weeks
Combinatorial Delay of a CLB-Max
0.9 ns
0.9 ns
JESD-30 Code
S-PBGA-B1136
S-PBGA-B1136
JESD-609 Code
e0
e1
Length
35 mm
35 mm
Moisture Sensitivity Level
4
4
Number of CLBs
3600
3600
Number of Inputs
480
480
Number of Logic Cells
46080
46080
Number of Outputs
480
480
Number of Terminals
1136
1136
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
3600 CLBS
3600 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1136,34X34,40
BGA1136,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
245
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.25 mm
3.25 mm
Supply Voltage-Max
10.5 V
10.5 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Temperature Grade
OTHER
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
2
2
Samacsys Manufacturer
AMD
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