XC5VLX50-1FFG1153C vs XC5VLX50-1FF1153C feature comparison

XC5VLX50-1FFG1153C AMD Xilinx

Buy Now Datasheet

XC5VLX50-1FF1153C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1153 BGA-1153
Pin Count 1153 1153
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 72 Weeks
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B1153 S-PBGA-B1153
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 3600 3600
Number of Inputs 560 560
Number of Logic Cells 46080 46080
Number of Outputs 560 560
Number of Terminals 1153 1153
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 3600 CLBS 3600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1153,34X34,40 BGA1153,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC5VLX50-1FFG1153C with alternatives

Compare XC5VLX50-1FF1153C with alternatives