XC5VLX30-2FFV324C vs XC5VLX30-2FFV676C feature comparison

XC5VLX30-2FFV324C AMD Xilinx

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XC5VLX30-2FFV676C AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA-324 BGA-676
Reach Compliance Code unknown unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B676
JESD-609 Code e1 e1
Length 19 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 2400 2400
Number of Inputs 220 400
Number of Logic Cells 30720 30720
Number of Outputs 220 400
Number of Terminals 324 676
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2400 CLBS 2400 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,18X18,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.85 mm 3 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 19 mm 27 mm
Base Number Matches 1 1

Compare XC5VLX30-2FFV324C with alternatives

Compare XC5VLX30-2FFV676C with alternatives