Findchips: Compare XC5VLX155T-3FFG1136C vs XC5VLX155T-2FFG1136C

XC5VLX155T-3FFG1136C vs XC5VLX155T-2FFG1136C feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	Yes
Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	XILINX INC	XILINX INC
Part Package Code	BGA	BGA
Package Description	BGA-1136	BGA-1136
Pin Count	1136	1136
Reach Compliance Code	compliant	compliant
ECCN Code	3A991.D	3A991.D
HTS Code	8542.39.00.01	8542.39.00.01
Combinatorial Delay of a CLB-Max	0.67 ns	0.77 ns
JESD-30 Code	S-PBGA-B1136	S-PBGA-B1136
JESD-609 Code	e1	e1
Length	35 mm	35 mm
Moisture Sensitivity Level	4	4
Number of CLBs	12160	12160
Number of Inputs	640	640
Number of Logic Cells	155648	155648
Number of Outputs	640	640
Number of Terminals	1136	1136
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min
Organization	12160 CLBS	12160 CLBS
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA1136,34X34,40	BGA1136,34X34,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Peak Reflow Temperature (Cel)	245	245
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	3.25 mm	3.25 mm
Supply Voltage-Max	1.05 V	1.05 V
Supply Voltage-Min	0.95 V	0.95 V
Supply Voltage-Nom	1 V	1 V
Surface Mount	YES	YES
Temperature Grade	OTHER	OTHER
Terminal Finish	TIN SILVER COPPER	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	35 mm	35 mm
Base Number Matches	1	1
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays