XC5VLX155T-3FF1136C
vs
XQ5VLX155T-2EF1136I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
XILINX INC
ADVANCED MICRO DEVICES INC
Part Package Code
BGA
Package Description
BGA-1136
FCBGA-1136
Pin Count
1136
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.D
HTS Code
8542.39.00.01
Combinatorial Delay of a CLB-Max
0.67 ns
0.77 ns
JESD-30 Code
S-PBGA-B1136
S-PBGA-B1136
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
4
Number of CLBs
12160
12160
Number of Inputs
640
640
Number of Logic Cells
155648
155648
Number of Outputs
640
640
Number of Terminals
1136
1136
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
12160 CLBS
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA1136,34X34,40
BGA1136,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.25 mm
3.4 mm
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
35 mm
35 mm
Base Number Matches
2
2
Clock Frequency-Max
1265 MHz
Technology
CMOS
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