XC5VLX155-3FF1153C vs XC5VLX155-1FF1153C feature comparison

XC5VLX155-3FF1153C AMD Xilinx

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XC5VLX155-1FF1153C AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1153 BGA-1153
Pin Count 1153 1153
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.67 ns 0.9 ns
JESD-30 Code S-PBGA-B1153 S-PBGA-B1153
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 12160 12160
Number of Inputs 800 800
Number of Logic Cells 155648 155648
Number of Outputs 800 800
Number of Terminals 1153 1153
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 12160 CLBS 12160 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1153,34X34,40 BGA1153,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC5VLX155-3FF1153C with alternatives

Compare XC5VLX155-1FF1153C with alternatives