XC5VLX155-2FF1760I vs XC5VLX155-2FF1760C feature comparison

XC5VLX155-2FF1760I AMD

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XC5VLX155-2FF1760C AMD

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Rohs Code No No
Part Life Cycle Code Active Active
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Package Description BGA-1760 BGA-1760
Reach Compliance Code not_compliant not_compliant
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1760 S-PBGA-B1760
JESD-609 Code e0 e0
Length 42.5 mm 42.5 mm
Moisture Sensitivity Level 4 4
Number of CLBs 12160 12160
Number of Inputs 800 800
Number of Logic Cells 155648 155648
Number of Outputs 800 800
Number of Terminals 1760 1760
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 12160 CLBS 12160 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1760,42X42,40 BGA1760,42X42,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.5 mm 3.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 42.5 mm 42.5 mm
Base Number Matches 2 2