XC5VLX155-1FF1153I vs XC5VLX155-1FFG1153I feature comparison

XC5VLX155-1FF1153I AMD Xilinx

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XC5VLX155-1FFG1153I AMD Xilinx

Buy Now Datasheet
Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1153 BGA-1153
Pin Count 1153 1153
Reach Compliance Code not_compliant compliant
ECCN Code 3A001.A.7.A 3A001.A.7.A
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B1153 S-PBGA-B1153
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 12160 12160
Number of Inputs 800 800
Number of Logic Cells 155648 155648
Number of Outputs 800 800
Number of Terminals 1153 1153
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 12160 CLBS 12160 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1153,34X34,40 BGA1153,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.4 mm 3.4 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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Compare XC5VLX155-1FFG1153I with alternatives