XC5VLX110T-2FFG1136C vs XC5VLX110T-2FF1136C feature comparison

XC5VLX110T-2FFG1136C AMD Xilinx

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XC5VLX110T-2FF1136C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1136 BGA-1136
Pin Count 1136 1136
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e1 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 8640 8640
Number of Inputs 640 640
Number of Logic Cells 110592 110592
Number of Outputs 640 640
Number of Terminals 1136 1136
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 8640 CLBS 8640 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2